英文短句/例句 1.As a starting point in our development, we should introduce advanced technology and equipment from the rest of the world.要引进国际上的先进技术、先进装备,作为我们发展的起点。 2.The Integration of Market Strategy and Technological Strategy to Construct Advanced Equipment Manufacture Ba...
本文主要从基板技术,元器件封装技术,先进组装技术和绿色制造技术等几个方面浅谈 SMT 技术的发展趋势。 3) Clean Pads 先进封装 4) Advanced technology 技术先进 例句>> 5) advanced technology 先进技术 1. The paper introduces the main characteristics andadvanced technologyof the casting and rolling machine in...
介绍了微电子镀覆在半导体和IC封装、凸点制作、多芯片组件以及微电子机械系统中的应用。 2. The process of design for clamping unit of auto molding in IC packaging was introduced,and finite element model of clamping unit was established. 介绍了IC封装热压模机合模机构的设计过程,建立了合模机构的有限元...
英文回答: Advanced Packaging for Pi Resin Applications. Advanced packaging technologies, such as fan-out wafer-level packaging (FOWLP) and system-in-package (SiP), are increasingly being used for pi resin applications. These technologies offer a number of advantages over traditional packaging methods...
CoWoS,英文全称为Chip-on-Wafer-on-Substrate,是一种2.5D、3D的封装技术,指将不同功能的模组做成小芯片(chiplet),全部封在一块芯片内。因此在一块芯片内,包含逻辑芯片、存储器、射频芯片和微机电芯片,不过该技术只服务7nm以下制程。 CoWoS可以分为「CoW」和「WoS」来理解,「CoW」指“Chip-on-Wafer”,意味芯片...
通过理论分析与实验数据说明了白光LED封装工艺对其性能的影响,特别针对模粒卡位、胶体外形等进行较为详细的分析。 2. The thermal stress distribution of SCSP in packaging process was studied by finite element method. 利用有限元法研究了堆叠芯片封装(SCSP)器件在封装工艺过程中的热应力分布。 更多例句>> 5...
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TSVHR-Si研究人员领域封装先进微电子英文TechnologyInterposer电子电路 TSVHR-Si研究人员领域封装先进微电子英文TechnologyInterposer电子电路TSV三维射频集成 高阻硅转接板技术 TSV 3D RF Integration HR-Si Interposer Technology英文 微电子先进封装领域研究人员参考 当代世界出版社图书专营店 进入店铺...
英文原文 https://www.technavio.com/report/semiconductor-advanced-packaging-market-industry-analysis?utm_source=prnewswire&utm_medium=pressrelease&utm_campaign=ai_rfsreport_week15_2024&utm_content=IRTNTR43230 点这里加关注,锁定更多原创内容 *免责声明:本文由作者原创。文章内容系作者个人观点,半导体行业观察...