CHIP_ENCHIP_EN ready time0.6-20ms VBORBOR occurs after 3.3V is lower than this voltage2--V TRSTThe required time that 3.3V is lower than VBOR1--ms 封装信息及生产指导 机械尺寸 WBR3 的 PCB 机械尺寸大小:16±0.35 mm (W)×24±0.35 mm (L) ×0.8±0.1 mm (H)。WBR3 的机械尺寸如下...
CHIP_EN CHIP_EN ready time 0.6 20 mS 复位 模块的底板设计时,模块的CHIP_EN脚预留复位IC,推荐IC型号为贝岭BL8506-27CRO,SOT23封装,参考电路如下(R30预留,可不贴). 封装信息和生产指导 机械尺寸 WBR3的PCB机械尺寸大小:16±0.35 mm (W)×24±0.35 mm (L) ×0.8±0.1 mm (H)。WBR3的机械尺寸...
The Tuya Sandwich Wi-Fi and Bluetooth LE combo wireless communication board has a WBR3 chip as a microcontroller, which is designed to help you easily prototype your IoT ideas. It can work with functional boards or circuit boards to implement specific features. ...
WBR3 Module Datasheet Last Updated on :2024-09-03 09:59:56download WBR3 is a low-power embedded Wi-Fi+Bluetooth module that Tuya has developed. It consists of a highly integrated RF chip (W701-VA2-CG), with an embedded Wi-Fi network protocol stack and varied library functions....
3 EN I 模组使能脚,正常使用需要接到 3.3V,对应 IC 的 CHIP_EN 4 PA15 I/O 普通IO 引脚,对应 IC 的 PA15 5 PA25 P 需要支持硬件 PWM,对应 IC 的 PA25 6 PA26 I/O 支持硬件 PWM 功能,对应 IC 的 PA26 7 PA28 I/O 需要支持硬件 PWM,对应 IC 的 PA28 8 3V3 P 模组的电源引脚(3.3V)...
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Hamamatsu S13496 Semiconductor Integrated Circuit Microcontrollers Voltage Regulators IC Chip Electronic Component Xc95144XL-7tqg100I US$0.10-0.90 / Piece J72479-100 Intel Camera Pz-Zu15eg-Kfb Puzhi Ealuation Board Adrv9009-W/Pcbz Adrv9009-W/Pcbz Tsw14j58evm S14160-1315PS Hamamatsu...
Only Reflow Soldering High Q Chip Multilayer Ceramic Capacitors for Automotive GCQ1555C1H1R3WB01_ (0402, C0G:EIA, 1.3pF, DC50V) _: packaging code Reference Sheet 1.Scope This product specification is applied to High Q Chip Multilayer Ceramic Capacitors used for Automotive Electronic equipment. Th...
This product specification is applied to Chip Monolithic Ceramic Capacitor High-Q Type used for General Electronic equipment. This product is applied for Only Reflow Soldering. ꢀꢀ 2.MURATA Part NO. System (Ex.) GJM 15 5 5C 1H 5R9 W B01 D (2)T Dimensions (1)L/...