网络孔洞;克氏空孔;没有克氏空孔
1.Introduction Kirkendall voids were usually observed at the Cu3Sn/Cu interface.Since the presence of voids decreases the bonded area,they would threaten the reliability of soldcr joints.Recent years,many researchers have found a close relationship between the formation of voids and the impurities ...
关键词:微焊点;柯肯达尔孔洞;可靠性;老化中图分类号:TN604 文献标识码:A 文章编号:1001—3474(2010)01—0001—05Kirkendall Voids in Micron Solder JointUsed in Electronic PackagingZOU Jian,、ⅣU Feng—shun,WANG Bo,LIU Hui,ZHOU Long—zao,WU Yi—ping(Huazhong University of Science&Technology,State ...
dissertation materials and, in particular, is fundamental in controlling and first paper [18], he reported zinc diffusivities in brass and suppressing the voids that are produced in the at three different temperatures. boundary region at a bonding interface. Currently, the Figure 2 shows ...
Growth mechanism of phases, Kirkendall voids, marker plane position, and indication of the relative mobilities of the species in the interdiffusion zoneGrowth mechanism of phases, Kirkendall voids, marker plane position, and indication of the relative mobilities of the species in the interdiffusion zone...
A large number of Kirkendall voids were observed at the interface betweenCu3SnandCu. The void formation resulted in weak bonding between solder andCuand led to brittle fracture at the interface in the ball shear and pull tests. The experimental results indicate that a barrier forCudiffusion may...
文章 分析了Kirkendall空洞形成机制,研究了抑制Kirkendall空洞的措施。 关键词 无铅钎料 电镀铜 Kirkendall空洞 抑制 中图分类号:TB34 文献标识码:A DOI:10.11896/j.issn.1005—023X.2015.023.026 TheStudyonSuppressingtheFormationofKirkendallVoids inSnBased/CuSolderJoint WANG Man一,YU Zhishui一,ZHANG Peilei一...
The formation of these voids strongly influences the mechanical properties. The Kirkendall experiment studied the diffusion of zinc and copper. Similar results have been found for a large range of binary alloys. In soldered joints, due to diffusion at the interfaces solder/substrate, void formation...
I摘要金属微互连结构是集成电路(IC)系统和微电子封装中的重要组成部分。随着电子产品不断向微型化、多功能化和高可靠性方向发展,芯片和元器件的封装密度不断提高,微互连结构间距和尺寸越来越小,导致微互连结构反应界面层占整个微互连结构的体积分数不断增加,而界面层微观组织对微互连结构可靠性的影响非常大。在服役过...
Sulfide-forming elements, 0.5 wt.% of Zn, Mn, and Cr, were added to the Sn–3.5Ag solder and reacted with Cu UBM which was electroplated using the SPS additive, and the effects of the alloying elements on Kirkendall voids were investigated. Results indicated that Kirkendall voiding decreased...