IT之家援引官方新闻稿,Rambus 公司的 HBM4 控制器 IP 不仅支持 JEDEC 规范中的 6.4 Gbps 传输速率,还能支持最高 10 Gbps 的数据传输速率,为每个内存设备提供 2.56 太字节每秒(TB/s)的数据吞吐量。 Rambus HBM4 控制器 IP 可结合第三方或客户自有的 PHY 解决方案,共同构建完整的 HBM4 内存子系统。 HBM4 ...
HBM4 Product BriefHBM3E/3 Product BriefHBM2E/2 Product BriefSpeed Bins (Gb/s)Up to 10Up to 9.6/8.4Up to 3.6/2.0Channel Densities (Gb)Up to 32Up to 32Up to 24Channels | Pseudo-Channels3216 | 328 | 16DRAM StacksUp to 16Up to 16Up to 12PHY InterfaceDFI StyleDFI StyleDFI StylePHY...
The Synopsys HBM3 PHY is a complete physical layer IP interface (PHY) solution for high-performance computing (HPC), AI, graphics, and networking ASIC, ASSP, and system-on-chip (SoC) applications requiring high-bandwidth HBM3 DRAM interfaces operating at up to 7200 Mbps. The synopsys HBM3 ...
The Synopsys HBM3 PHY is a complete physical layer IP interface (PHY) solution for high-performance computing (HPC), AI, graphics, and networking ASIC, ASSP, and system-on-chip (SoC) applications requiring high-bandwidth HBM3 DRAM interfaces operating at up to 7200 Mbps. The synopsys HBM3 ...
HBM2Econtroller(HBMC),physical-layerinterface(PHY),andI/Oportstointerfaceto theHBM2Estack.TheFPGAcoreaccessestheUIBthroughtheintegratedhard memorynetwork-on-chip(NoC). Asillustratedinthefigurebelow,eachAgilex7M-Seriesdevicecontainsasingle universalinterfacebusperHBM2Einterface,supporting8independentchannels.The ...
在先进封装中，随着堆叠密度提 升，需要热界面材料（Thermal Interface Material, TIM）以实现散热升级需 求。热界面材料主要用于填充电子元件和散热器间空气的间隙，建立有效热 传导通道，可以大幅降低热阻，使散热器作用得到充分发挥。其中,TIM1 主 要放置在芯片和散热金属盖之间，TIM2 主要放置在半导体封装外部和散热...
Product BriefSpeed Bins (Gb/s)Up to 10Up to 9.6/8.4Up to 3.6/2.0Channel Densities (Gb)Up to 32Up to 32Up to 24Channels | Pseudo-Channels3216 | 328 | 16DRAM StacksUp to 16Up to 16Up to 12PHY InterfaceDFI StyleDFI StyleDFI StylePHY Independent ModeYesYesYesRefresh Management SupportYe...
HBM2 Memory Interface Subsystem Example Rambus HBM2/2E PHY 完全符合 JEDEC JESD235B 标准,支持每个数据引脚高达 3.6 Gbps 的数据速率,总带宽因此达到 461 GB/s。该接口具有 8 个独立信道,每个信道包含 128 位,总数据宽度为 1024 位,支持 2、4、8 或 12 个 DRAM 的堆栈高度。此外,PHY 专为 2.5D 系统...
在先进封装中,随着堆叠密度提 升,需要热界面材料(Thermal Interface Material, TIM)以实现散热升级需 求。热界面材料主要用于填充电子元件和散热器间空气的间隙,建立有效热 传导通道,可以大幅降低热阻,使散热器作用得到充分发挥。其中,TIM1 主 要放置在芯片和散热金属盖之间,TIM2 主要放置在半导体封装外部和散热 器...
This document describes a general layout scheme and Innosilicon HBM3/3E PHY connecting to the controller using a DFI digital interface. All interface timing is in 1X SDR clock domain. This interface is flexible and can be converted to any customer desired format and timing sequence. The PHY to...